Combined OES and laser Interferometry
The
wide range of problems encountered in process development and
production control cannot always be solved by one single technique.
Optical Emission Spectroscopy (OES) provides the selectivity for
small open areas and complicated plasma chemistries but gives no
information about etch rate or relative thickness.
Interferometry, however,
provides both etch rate and thickness but is more sensitive to the
optical and geometrical properties of the material. Combining OES and
interferometry gives the user all the advantages of both the DIGILEM
and DIGISEM in a single instrument. This
gives the ability to use both techniques, either simultaneously or
independently depending on the application. For example the etch rate
can be determined using interferometry and the endpoint at a buried
interface can be established using optical emission spectroscopy.
Applications
Typical Schematic

We can offer the DIGITWIN
with any combination of our sensors, such as twin
OES systems for dual wavelength ratio monitoring.
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