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MULTISEM

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MULTISEM
User Guide

 Process Applications

EPD at Interfaces

EPD at Depths

Optical Emission Spectroscopy

Thicknesses, refractive indices and absorption constants

Depth Targeting for MEMS

III-V Process Control

Flat Panel Display Film Thickness

Thin dielectric and transparent film

Real-time process monitoring

Ultra-thin gate oxide (UTGO) layer thicknesses

Pulsed Plasma Monitoring

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Simultaneous Real Time Multi-Chamber - Multi diagnosis monitor.

The MULTISEM design concept is based on an open parallel architecture consisting of a central supervisor control unit, and a network of analytical substations. In a cluster tool configuration, an instrumentation unit, with its own processor and hard disk, is connected to each chamber of the tool and is linked to the MULTISEM supervisor by a local area network (LAN). The supervisor performs simultaneously, all instrument control and acquisition functions via a windows type user interface and communicates with the processing tool through a SECS II or customised link. Support for almost all commercially available etchers is available.

The MULTISEM is a modular instrumentation platform, incorporating a supervisor station, and up to 16 remote sensors and their associated controller unit. OES, UV and laser interferometry, ellipsometry and electrostatic probing, as well as other sensors can all be integrated into a single station to provide unparalleled comprehensive process control. The flexibility of the system allows the customer to tailor a unique configuration of analytical techniques, specific to the individual process monitoring of each chamber.

MULTI-CHAMBER MONITORING

The production of sub micron feature semiconductor devices relies heavily on the use of cluster tools with several chambers for the different etching or deposition steps. Process reliability and yields are enhanced by closed loop control, which requires the use of specific in situ diagnostic techniques for accurate end point detection on each chamber. The MULTISEM allows multiple endpoint detectors operating on different chambers of a cluster tool to be controlled via a single user interface. A SECS II link to the tool allows information such as the current step and batch to be obtained by the MULTISEM this allows the appropriate step to be run and informative database management to be performed.

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MULTI-SENSOR SUPPORT

Research and development and set up of new processes often requires several complementary diagnostic measurements. The MULTISEM platform allows multiple sensors to be controlled through a single user interface.

MAIN FEATURES
  • Modular platform for multi-chamber and multi-sensor applications

  • Can use of the Jobin Yvon sensors such OES (DIGISEM), UV and laser interferometry, (DIGILEM)
  • Supervision of up to 16 chambers in real-time
  • Supervision of up to 32 sensors in real-time
  • All substations are linked through a L.A.N.
  • Support for almost all commercially available etch tools.
  • Asynchronous start/stop of the chambers is controlled via a remote control link.
  • The supervisor includes a SECS II link
  • Comprehensive database support.

SCHEMATICALLY

 

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