Jobin Yvon inroduces a patented Twin Spot Interferometric Camera for in-situ process control for MEMS

News & Events

Current Press Releases

Past Press Releases

Events

Thin Film Links

Ellipsometry
Applications
Basic Principles
Ex-Situ UVISEL
In-Situ UVISEL
Optical Set-up
Software

Process Control
DIGISEM
DIGILEM
DIGITWIN
MULTISEM
User Guide

Contact Angle

TWIN SPOT INTERFEROMETRIC CAMERA OFFERS PROCESS CONTROL FOR MEMS.

Jobin Yvon Ltd. are proud to introduce their NEW patented Twin Spot Interferometric Camera. Designed for real time in-situ process control for MEMS applications including: measurement of large feature etch rates, deep trench etch rates and end point determination. Etch rate measurements are performed using two separate laser beams which can be accurately positioned (one in the trench the other on the mask) using a manual or motorized translation stage. An optional pattern regcognition system automatically positions the beams to predefined wafer positions for a totally automated system even on patterned wafers.

The Twin Spot Interferometric Camera extends the capabilities of the existing single spot DIGILEM camera and it is fully compatable with the exisiting SOFIE software platform. This includes; real time in-situ process control, user programmable steps, high sensitivity endpoint algorithms, data management, etch rate fitting methods and reprocessing for review and post process analysis of runs.

Like all our sensors the Twin Spot Interferometric Camera is equally suitable as a stand alone system or integrated into a Multisem platform for multiple chamber process control. Alternatively it may be coupled with a DIGISEM optical emission spectrometer to form a DIGITWIN.

For further information please contact:

Click here for more information on end point detection Automated Spectroradiometer.