MEMS Process Control

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The Jobin Yvon Twin Spot Interferometric Camera (patented) provides real time process control capabilities for MEMS applications. The Twin Spot Camera is optimised for the characterisation of large feature etch rates, deep trench etches out to 500 microns and end point determination.

Etch rate measurements are performed using two separated laser beams that can be accurately positioned (one in the trench the other on the mask) using a manual or motorised translation stage. An optional pattern recognition system positions the beams to predefined wafer positions to provide a totally automated system even on patterned wafers.

The Twin Spot Interferometric Camera extends the capabilities of the well proven single spot DIGILEM camera allowing Jobin Yvon to control and end point the full range of trench depths and etch rates. The instrument software includes; real time in-situ process control, user programmable steps, high sensitivity endpoint algorithms, data management, etch rate fitting methods and reprocessing for review and post process analysis of runs.

The Twin Spot Interferometric Camera may be used as a stand alone system or integrated into our MULTISEM for multiple chamber process control. It may be also be coupled with a DIGISEM optical emission spectrometer to form a DIGITWIN.